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Using latest equipment, we can achieve advance technology:
Quick prototyping
Rigid boards from 1 to 36layers
Flex circuits from 1 to 16layers
IC Substrate boards from 2 to 16layers
Controlled impedance: +/-5%
Copper thickness up to 12oz
Hole size: 0.1 mm/0.004 inch minimum (4 mil)
Trace size: 0.062 mm/0.0025 inch minimum (2.5 mil)
Trace spacing: 0.062 mm/0.0025 inch minimum (2.5 mil)
Aspect ratio: 20:1
Materials: FR-4, High Tg Material (Tg = 180º C), BT, Rogers, Nelco,ISOLA, PTFE,polyamide, and ceramic material
Finished board thickness: 0.1 mm/0.004 inch to 9.40 mm/0.370 inch;
HAL, lead-free HAL, Flash gold, ENIG, ENEPIG, gold finger plating, selective gold plating, Entek, immersion tin, immersion silver surface finishes
Silver ink through holes, silver and carbon ink jumper, carbon printing, peelable solder mask
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