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Using latest equipment, we can achieve advance technology:

Quick prototyping

Rigid boards from 1 to 36layers

Flex circuits from 1 to 16layers

IC Substrate boards from 2 to 16layers

Controlled impedance: +/-5%

Copper thickness up to 12oz

Hole size: 0.1 mm/0.004 inch minimum (4 mil)

Trace size: 0.062 mm/0.0025 inch minimum (2.5 mil)

Trace spacing: 0.062 mm/0.0025 inch minimum (2.5 mil)

Aspect ratio: 20:1

Materials: FR-4, High Tg Material (Tg = 180º C), BT, Rogers, Nelco,ISOLA, PTFE,polyamide, and ceramic material

Finished board thickness: 0.1 mm/0.004 inch to 9.40 mm/0.370 inch;

HAL, lead-free HAL, Flash gold, ENIG, ENEPIG, gold finger plating, selective gold plating, Entek, immersion tin, immersion silver surface finishes

Silver ink through holes, silver and carbon ink jumper, carbon printing, peelable solder mask

 

 
 
     
   
 

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Unsere Profession ist die PCB Produktion
WIR bieten Ihnen „high quality“ professionell produzierte PCBs.
WIR produzieren nach EUROPÄISCHEN STANDARDS.
WIR sind nach EN ISO 14001-2004 STANDARDS zertifiziert.

info@huasuncorp.com
www.huasuncorp.com